Invention Grant
US08373259B2 Optical connection through single assembly overhang flip chip optics die with micro structure alignment
有权
光学连接通过单组件悬挂倒装芯片光学裸片与微结构对准
- Patent Title: Optical connection through single assembly overhang flip chip optics die with micro structure alignment
- Patent Title (中): 光学连接通过单组件悬挂倒装芯片光学裸片与微结构对准
-
Application No.: US12844656Application Date: 2010-07-27
-
Publication No.: US08373259B2Publication Date: 2013-02-12
- Inventor: Brian H. Kim , Simon S. Lee
- Applicant: Brian H. Kim , Simon S. Lee
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L23/02
- IPC: H01L23/02 ; G02B6/26
Abstract:
A system includes an optical transceiver assembly, including a flip chip connection of a semiconductor die with a photonic transceiver that overhangs a substrate to which it is to be connected. The assembly further includes an alignment pin that is held to the semiconductor die at a micro-engineered structure in the semiconductor die. The alignment pin provides passive alignment of the photonic transceiver with an optical lens that interfaces the photonic transceiver to one or more optical channels.
Public/Granted literature
- US20120025209A1 OPTICAL CONNECTION THROUGH SINGLE ASSEMBLY OVERHANG FLIP CHIP OPTICS DIE WITH MICRO STRUCTURE ALIGNMENT Public/Granted day:2012-02-02
Information query
IPC分类:
