A source driver of a film package type including a film substrate; a semiconductor chip on a surface of the film substrate, the semiconductor chip having a plurality of terminals, the plurality of terminals including input terminals, output terminals, and third terminals; an input terminal wiring region for receiving first wiring lines which are connected to the input terminals; an output terminal wiring region for receiving second wiring lines which are connected to the output terminals; sprocket portions at opposite ends of the film substrate; and a heat conducting patterns for connecting the third terminals. This makes it possible to provide a source driver, a method for manufacturing the source driver, and a liquid crystal module, each of which can increase a heat dissipation amount.