Invention Grant
- Patent Title: Heat sink mounted on a vehicle-transmission case
- Patent Title (中): 散热器安装在车辆传动箱上
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Application No.: US11693280Application Date: 2007-03-29
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Publication No.: US08373266B2Publication Date: 2013-02-12
- Inventor: Iyad Alhayed , Gerry Bianco
- Applicant: Iyad Alhayed , Gerry Bianco
- Applicant Address: US MI Auburn Hills
- Assignee: Continental Automotive Systems, Inc.
- Current Assignee: Continental Automotive Systems, Inc.
- Current Assignee Address: US MI Auburn Hills
- Main IPC: H01L23/36
- IPC: H01L23/36
Abstract:
A system for dissipating heat from a semiconductor board includes a first substrate including an opening formed therein, a second substrate attached to a surface of the first substrate, and a microchip positioned in the opening and bumped to the second substrate. The system further includes a heat sink directly adhered to the microchip. A method of manufacturing a heat dissipating semiconductor board includes forming an opening in a first substrate and positioning a microchip in the opening. The method further includes directly adhering the microchip to a heat sink, bonding the microchip to a second substrate and boding a surface of the first substrate to the second substrate.
Public/Granted literature
- US20080236782A1 THERMAL DISSIPATION IN CHIP Public/Granted day:2008-10-02
Information query
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