Invention Grant
US08373269B1 Jigs with controlled spacing for bonding dies onto package substrates
有权
具有可控间隔的夹具用于将模具贴合到封装衬底上
- Patent Title: Jigs with controlled spacing for bonding dies onto package substrates
- Patent Title (中): 具有可控间隔的夹具用于将模具贴合到封装衬底上
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Application No.: US13227969Application Date: 2011-09-08
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Publication No.: US08373269B1Publication Date: 2013-02-12
- Inventor: Yi-Li Hsiao , Chen-Hua Yu , Chung-Shi Liu , Chien Ling Hwang
- Applicant: Yi-Li Hsiao , Chen-Hua Yu , Chung-Shi Liu , Chien Ling Hwang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L21/50 ; H01L21/48 ; H01L21/44
Abstract:
A device includes a lower jig and an upper jig, wherein the lower jig and the upper jig are configured to secure a package substrate. The lower jig includes a first base material and a first plurality of features attached to the first base material. The first plurality of features is disposed adjacent to a peripheral of the lower jig. The upper jig includes a second base material and a second plurality of features attached to the second base material. The second plurality of features is disposed adjacent to a peripheral of the upper jig. The first plurality of features is configured to be attracted to the second plurality of features by a magnetic force.
Information query
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