Invention Grant
- Patent Title: Stacked die in die BGA package
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Application No.: US12020738Application Date: 2008-01-28
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Publication No.: US08373277B2Publication Date: 2013-02-12
- Inventor: Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
- Applicant: Hock Chuan Tan , Thiam Chye Lim , Victor Cher Khng Tan , Chee Peng Neo , Michael Kian Shing Tan , Beng Chye Chew , Cheng Poh Pour
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L23/12
- IPC: H01L23/12
Abstract:
Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
Public/Granted literature
- US20080136045A1 Stacked die in die BGA package Public/Granted day:2008-06-12
Information query
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