Invention Grant
US08373283B2 Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device
失效
粘合剂组合物，薄膜状粘合剂，粘合片和半导体装置
- Patent Title: Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device
- Patent Title (中): 粘合剂组合物，薄膜状粘合剂，粘合片和半导体装置
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Application No.: US13057322Application Date: 2009-04-30
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Publication No.: US08373283B2Publication Date: 2013-02-12
- Inventor: Takashi Masuko , Shigeki Katogi
- Applicant: Takashi Masuko , Shigeki Katogi
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JPP2008-200347 20080804; JPP2008-279988 20081030
- International Application: PCT/JP2009/058502 WO 20090430
- International Announcement: WO2010/016305 WO 20100211
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/48 ; H01L29/40
Abstract:
The adhesive composition of the invention comprises (A) a thermoplastic resin with a Tg of no higher than 100° C. and (B) a thermosetting component, wherein the (B) thermosetting component includes (B1) a compound with an allyl group and (B2) a compound with a maleimide group.
Public/Granted literature
- US20110187009A1 ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET AND SEMICONDUCTOR DEVICE Public/Granted day:2011-08-04
Information query
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