Invention Grant
US08373384B2 Capacitor-integrated feedthrough assembly with improved grounding for an implantable medical device
有权
电容器集成馈通组件,其具有用于可植入医疗装置的改进的接地
- Patent Title: Capacitor-integrated feedthrough assembly with improved grounding for an implantable medical device
- Patent Title (中): 电容器集成馈通组件,其具有用于可植入医疗装置的改进的接地
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Application No.: US12877876Application Date: 2010-09-08
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Publication No.: US08373384B2Publication Date: 2013-02-12
- Inventor: Leev Zavie
- Applicant: Leev Zavie
- Applicant Address: US CA Sylmar
- Assignee: Pacesetter, Inc.
- Current Assignee: Pacesetter, Inc.
- Current Assignee Address: US CA Sylmar
- Main IPC: H01M10/46
- IPC: H01M10/46

Abstract:
A feedthrough assembly for use with implantable medical devices having a shield structure, the feedthrough assembly engaging with the remainder of the associated implantable medical device to form a seal with the medical device to inhibit unwanted gas, liquid, or solid exchange into or from the device. One or more feedthrough wires extend through the feedthrough assembly to facilitate transceiving of the electrical signals with one or more implantable patient leads. The feedthrough assembly is connected to a mechanical support which houses one or more filtering capacitors that are configured to filter and remove undesired frequencies from the electrical signals received via the feedthrough wires before the signals reach the electrical circuitry inside the implantable medical device. The mechanical support may further include an isolation structure that isolates the feedthrough wires.
Public/Granted literature
- US20110009917A1 CAPACITOR-INTEGRATED FEEDTHROUGH ASSEMBLY WITH IMPROVED GROUNDING FOR AN IMPLANTABLE MEDICAL DEVICE Public/Granted day:2011-01-13
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