Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13450291Application Date: 2012-04-18
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Publication No.: US08373453B2Publication Date: 2013-02-12
- Inventor: Masaki Naganawa
- Applicant: Masaki Naganawa
- Applicant Address: JP Kawasaki-shi, Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-shi, Kanagawa
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2008-071438 20080319
- Main IPC: H03B1/00
- IPC: H03B1/00

Abstract:
A circuit including a first buffer coupled to a power line to output a first output signal based on a data signal to an output terminal, a second buffer coupled to the power line to output a second output signal based on the data signal to the output terminal when a control signal is in a predetermined level, and a control circuit coupled to the power line and the control signal.
Public/Granted literature
- US20120262134A1 SEMICONDUCTOR DEVICE Public/Granted day:2012-10-18
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