Invention Grant
- Patent Title: High-frequency switch module and high-frequency switch apparatus
- Patent Title (中): 高频开关模块和高频开关装置
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Application No.: US13547084Application Date: 2012-07-12
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Publication No.: US08373492B2Publication Date: 2013-02-12
- Inventor: Hisanori Murase , Takanori Uejima
- Applicant: Hisanori Murase , Takanori Uejima
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2008-269642 20081020
- Main IPC: H03K17/56
- IPC: H03K17/56

Abstract:
A high-frequency switch module includes a multi-layer substrate, and a switch circuit mounted on the multi-layer substrate. The multi-layer substrate includes a terminal through which a plurality of high-frequency signals in a plurality of frequency bands are input and output, a plurality of switch terminals, terminals to which control signals to control the switch circuit are supplied, current paths that connect the terminals to the switch circuit, and resistors that are provided on the current paths and have resistance values greater than the resistance values of the current paths. The switch circuit connects the terminal to the switch terminals corresponding to the frequency bands of high-frequency signals input and output through the terminal based on the control signals.
Public/Granted literature
- US20120293237A1 HIGH-FREQUENCY SWITCH MODULE AND HIGH-FREQUENCY SWITCH APPARATUS Public/Granted day:2012-11-22
Information query
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