Invention Grant
- Patent Title: Power module and circuit board assembly thereof
- Patent Title (中): 电源模块及其电路板组件
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Application No.: US12851237Application Date: 2010-08-05
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Publication No.: US08373533B2Publication Date: 2013-02-12
- Inventor: Han Li , Gang Liu , Jing Chen , Jinfa Zhang
- Applicant: Han Li , Gang Liu , Jing Chen , Jinfa Zhang
- Applicant Address: TW Taoyuan Hsien
- Assignee: Delta Electronics, Inc.
- Current Assignee: Delta Electronics, Inc.
- Current Assignee Address: TW Taoyuan Hsien
- Agency: Kirton McConkie
- Agent Evan R. Witt
- Priority: TW98126685A 20090806
- Main IPC: H01F27/29
- IPC: H01F27/29

Abstract:
A power module includes a first bobbin, a primary winding coil, a circuit board assembly and a first magnetic core assembly. The primary winding coil is wound around the first bobbin. The circuit board assembly includes a printed circuit board, a second winding structure, at least one current-sensing element, a rectifier circuit and an electrical connector. The second winding structure has an output terminal. The current-sensing element includes a first conductor. The first conductor is a conductive sheet. A first end of the first conductor is in contact with the output terminal of the second winding structure. A second end of the first conductor is connected to the rectifier circuit. The primary winding coil is aligned with the second winding structure of the circuit board assembly and arranged within the first magnetic core assembly. The primary winding coil and the electrical connector are electrically connected with a system board.
Public/Granted literature
- US20110032683A1 POWER MODULE AND CIRCUIT BOARD ASSEMBLY THEREOF Public/Granted day:2011-02-10
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