Invention Grant
US08373966B2 Structural body, capacitor, and method of fabricating the capacitor 有权
结构体,电容器和制造电容器的方法

Structural body, capacitor, and method of fabricating the capacitor
Abstract:
A structural body which includes a first dielectric layer formed on a first substrate and including first conductive particles, each surface of the first conductive particles being entirely covered with a first dielectric film; and a second dielectric layer formed on the first dielectric layer wherein a volume ratio of a dielectric in the second dielectric layer is higher than a volume ratio of a dielectric in the first dielectric layer.
Information query
Patent Agency Ranking
0/0