Invention Grant
US08373966B2 Structural body, capacitor, and method of fabricating the capacitor
有权
结构体,电容器和制造电容器的方法
- Patent Title: Structural body, capacitor, and method of fabricating the capacitor
- Patent Title (中): 结构体,电容器和制造电容器的方法
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Application No.: US12575791Application Date: 2009-10-08
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Publication No.: US08373966B2Publication Date: 2013-02-12
- Inventor: Yoshihiko Imanaka
- Applicant: Yoshihiko Imanaka
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2008-293792 20081117
- Main IPC: H01G4/018
- IPC: H01G4/018

Abstract:
A structural body which includes a first dielectric layer formed on a first substrate and including first conductive particles, each surface of the first conductive particles being entirely covered with a first dielectric film; and a second dielectric layer formed on the first dielectric layer wherein a volume ratio of a dielectric in the second dielectric layer is higher than a volume ratio of a dielectric in the first dielectric layer.
Public/Granted literature
- US20100123996A1 STRUCTURAL BODY, CAPACITOR, AND METHOD OF FABRICATING THE CAPACITOR Public/Granted day:2010-05-20
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