Invention Grant
- Patent Title: Stackable capacitor structure
- Patent Title (中): 可堆叠电容器结构
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Application No.: US13172836Application Date: 2011-06-30
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Publication No.: US08373973B2Publication Date: 2013-02-12
- Inventor: Chun-An Lai
- Applicant: Chun-An Lai
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW100112105A 20110407
- Main IPC: H01G9/04
- IPC: H01G9/04 ; H01G4/38 ; H01M6/42 ; H01M8/24 ; H01M2/20

Abstract:
A capacitor includes a main body, a first seat, and a second seat. The main body includes a first end surface and a second end surface opposite to the first end surface. Two first pins extend upward from the first end surface. Two second pins extend downward from the second end surface. The first pins electrically connect the second pins. The first seat includes a first substrate and two first pads, the first seat is positioned on the second end surface of the main body and the first pads are electrically connected to the second pins. The second seat includes a second substrate and two second pads, the second seat is positioned on the first end surface of the main body and the second pads are electrically connected to the first pins.
Public/Granted literature
- US20120257321A1 STACKABLE CAPACITOR STRUCTURE Public/Granted day:2012-10-11
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