Invention Grant
- Patent Title: Molded assembly
- Patent Title (中): 模压装配
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Application No.: US12906535Application Date: 2010-10-18
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Publication No.: US08373985B2Publication Date: 2013-02-12
- Inventor: Ramon Lamers , Albert Pegg , Martin Mape
- Applicant: Ramon Lamers , Albert Pegg , Martin Mape
- Applicant Address: CA Waterloo
- Assignee: Research In Motion Limited
- Current Assignee: Research In Motion Limited
- Current Assignee Address: CA Waterloo
- Agency: Novak Druce + Quigg LLP
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K5/00 ; H05K7/00

Abstract:
Electronic device comprising frame and trim. Trim wrapped around at least three sides of the frame. Trim comprising an outer piece and an inner assembly. Outer piece of substantially continuous flexible tactile material comprising a substantially elongate first side portion, a substantially elongate second side portion substantially parallel to the first side portion, and at least one substantially elongate cross portion connecting the first and second side portions. The inner assembly comprising a substantially rigid first side inner piece substantially coextensive with the outer piece first side portion; a substantially rigid second side inner piece substantially coextensive with the outer piece second side portion; and at least one substantially rigid inner cross piece. Each cross piece substantially coextensive with the short dimension of the outer piece cross portion, and shorter than the long dimension of the outer piece cross portion, thereby creating at least one gap in the inner assembly.
Public/Granted literature
- US20110273823A1 MOLDED ASSEMBLY Public/Granted day:2011-11-10
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