Invention Grant
- Patent Title: Hinge assembly and portale electronic device using the same
- Patent Title (中): 铰链组装和portale电子设备使用相同
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Application No.: US12902227Application Date: 2010-10-12
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Publication No.: US08373993B2Publication Date: 2013-02-12
- Inventor: Shu-Wei Chang , Fu-Hsiung Yang
- Applicant: Shu-Wei Chang , Fu-Hsiung Yang
- Applicant Address: TW New Taipei
- Assignee: Chi Mei Communication Systems, Inc.
- Current Assignee: Chi Mei Communication Systems, Inc.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW99113755 20100429
- Main IPC: H05K5/00
- IPC: H05K5/00
Abstract:
A hinge assembly includes an axle portion having first and second ends, a first hinged portion, a second hinged portion, and at least one conductive member. The first hinged portion is inserted into one end of the axle portion. The other end of the axle portion is received the second hinged portion. The conductive member is positioned between the axle portion and one of the first hinged portion and the second hinged portion.
Public/Granted literature
- US20110267785A1 HINGE ASSEMBLY AND PORTALE ELECTRONIC DEVICE USING THE SAME Public/Granted day:2011-11-03
Information query
