Invention Grant
- Patent Title: Structure comprising opto-electric hybrid board and opto-electric package
- Patent Title (中): 结构包括光电混合板和光电封装
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Application No.: US12559637Application Date: 2009-09-15
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Publication No.: US08374470B2Publication Date: 2013-02-12
- Inventor: Takuma Ban , Yasunobu Matsuoka
- Applicant: Takuma Ban , Yasunobu Matsuoka
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Mattingly & Malur, PC
- Main IPC: G02B6/30
- IPC: G02B6/30 ; G02B6/32

Abstract:
A structure which stably achieves electrical coupling, and is capable of efficient optical coupling is provided. Optical coupling is achieved with the lower surface of an opto-electric package and the upper surface of an opto-electric hybrid board. On the other hand, electrical connection is achieved by means of contact between electrodes on the side surfaces of the opto-electric package and electrodes on the inner-wall side surfaces of a socket mounted on the opto-electric hybrid board. The electrodes are in electrical contact with electrical wiring.
Public/Granted literature
- US20100054671A1 STRUCTURE COMPRISING OPTO-ELECTRIC HYBRID BOARD AND OPTO-ELECTRIC PACKAGE Public/Granted day:2010-03-04
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