Invention Grant
- Patent Title: Method for manufacturing a condenser microphone
- Patent Title (中): 制造电容麦克风的方法
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Application No.: US13031931Application Date: 2011-02-22
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Publication No.: US08375560B2Publication Date: 2013-02-19
- Inventor: Jean-Yih Tsai , Chung-Ching Lai , Chao-Chih Chang
- Applicant: Jean-Yih Tsai , Chung-Ching Lai , Chao-Chih Chang
- Applicant Address: TW Taichung
- Assignee: Taiwan Carol Electronics Co., Ltd.
- Current Assignee: Taiwan Carol Electronics Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Law Offices of Albert Wai-Kit Chan, PLLC
- Main IPC: H04R31/00
- IPC: H04R31/00

Abstract:
A method for manufacturing a condenser microphone includes forming a diaphragm module using microelectromechanical system (MEMS) techniques. The diaphragm module includes a diaphragm that is deformable by energy of sound waves, and a diaphragm spacer that extends from one side of the diaphragm and controls a tension of the diaphragm. The method further includes providing a backplate with vent holes, aligning the vent holes of the backplate with a central region of the diaphragm, and connecting the backplate to the diaphragm spacer to construct a transducer unit. The diaphragm spacer, the diaphragm and the backplate cooperate to form an air chamber in fluid communication with an environment external to the condenser microphone. The backplate and the diaphragm cooperate to form a condenser. The method further includes enclosing the transducer unit in a housing that includes a shell and a circuit board to form the condenser microphone.
Public/Granted literature
- US20120210560A1 METHOD FOR MANUFACTURING A CONDENSER MICROPHONE Public/Granted day:2012-08-23
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