Invention Grant
- Patent Title: Forming apparatus and forming method of wire joint portion
- Patent Title (中): 电线接头部分的成形装置和成形方法
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Application No.: US13133417Application Date: 2009-12-25
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Publication No.: US08375573B2Publication Date: 2013-02-19
- Inventor: Kouji Daitou , Mikitsugu Suzuki , Kenji Tanaka , Noriyuki Fukaya , Tetsuro Ide
- Applicant: Kouji Daitou , Mikitsugu Suzuki , Kenji Tanaka , Noriyuki Fukaya , Tetsuro Ide
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2008-333064 20081226; JP2009-124257 20090522
- International Application: PCT/JP2009/071910 WO 20091225
- International Announcement: WO2010/074349 WO 20100701
- Main IPC: H01R43/00
- IPC: H01R43/00 ; B23P19/04

Abstract:
A forming apparatus for forming a wire joint portion including a connection portion and an insulative tube covering the connection portion is provided. The forming apparatus includes: a production information acquiring unit which acquires production information; a connection portion forming unit which fixes a plurality of wires selected on the basis of the production information, and then electrically connects conductor portions of the wires together to form the connection portion; a first fusing unit which fuses one open end portion of the insulative tube to close the one open end portion; an inserting unit which moves the wires so as to insert the connection portion into the insulative tube through the other open end portion of the insulative tube; a second fusing unit which fuses the other open end portion of the insulative tube and insulative sheaths of the wires together so as to form the wire joint portion.
Public/Granted literature
- US20110232083A1 FORMING APPARATUS AND FORMING METHOD OF WIRE JOINT PORTION Public/Granted day:2011-09-29
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