Invention Grant
US08375887B2 Solution treatment apparatus, solution treatment method and resist coating method
有权
溶液处理装置,固溶处理方法和抗蚀剂涂布方法
- Patent Title: Solution treatment apparatus, solution treatment method and resist coating method
- Patent Title (中): 溶液处理装置,固溶处理方法和抗蚀剂涂布方法
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Application No.: US12656997Application Date: 2010-02-23
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Publication No.: US08375887B2Publication Date: 2013-02-19
- Inventor: Koji Takayanagi , Naofumi Kishita
- Applicant: Koji Takayanagi , Naofumi Kishita
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Posz Law Group, PLC
- Priority: JP2009-051174 20090304
- Main IPC: B05B1/28
- IPC: B05B1/28 ; B05C11/02 ; B05C5/00

Abstract:
The invention includes a lower guide unit which obliquely extends downward to an outside from a position closely opposed to a peripheral edge portion of a rear surface of the substrate held on the substrate holding unit, and is formed in an annular shape in a circumferential direction of the substrate; and an upper guide unit which has an upper end surface located at a substantially same height as a front surface of the substrate held on the substrate holding unit, forms a lower annular flow path between the upper guide unit and the lower guide unit for guiding downward together with a gas flow a treatment solution scattering from the substrate, is formed in an annular shape opposed to the lower guide unit to surround an outside lower region of the substrate, and has an inner peripheral surface having a longitudinal-sectional shape curved to bulge outward and extending downward.
Public/Granted literature
- US20100227056A1 Solution treatment apparatus, solution treatment method and resist coating method Public/Granted day:2010-09-09
Information query
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