Invention Grant
US08376012B2 Component press-bonding apparatus and component press-bonding method 有权
部件压接装置和部件压接方法

  • Patent Title: Component press-bonding apparatus and component press-bonding method
  • Patent Title (中): 部件压接装置和部件压接方法
  • Application No.: US13513929
    Application Date: 2010-12-03
  • Publication No.: US08376012B2
    Publication Date: 2013-02-19
  • Inventor: Syozo Kadota
  • Applicant: Syozo Kadota
  • Applicant Address: JP Osaka
  • Assignee: Panasonic Corporation
  • Current Assignee: Panasonic Corporation
  • Current Assignee Address: JP Osaka
  • Agency: Wenderoth, Lind & Ponack, L.L.P.
  • Priority: JP2009-277679 20091207
  • International Application: PCT/JP2010/007050 WO 20101203
  • International Announcement: WO2011/070753 WO 20110616
  • Main IPC: B32B38/18
  • IPC: B32B38/18
Component press-bonding apparatus and component press-bonding method
Abstract:
In a component press-bonding apparatus including a press-bonding tool for press-bonding a component, which is placed on a panel, to the panel via a sheet, the press-bonding tool is provided so as to be movable in a first direction (X-axis direction) orthogonal to a press-bonding direction. The component press-bonding apparatus has a sheet conveyance unit comprising: a feed reel which feeds a sheet in a second direction (Y-axis direction) orthogonal to the press-bonding direction and the first direction and which is movable in the first direction; a path member which forms a sheet path extending from the feed reel in the second direction and reaching the press-bonding tool and which is movable in the first direction; and a feed roller for feeding the sheet in the second direction. The feed roller is removably fitted to the sheet conveyance unit.
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