Invention Grant
- Patent Title: Component press-bonding apparatus and component press-bonding method
- Patent Title (中): 部件压接装置和部件压接方法
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Application No.: US13513929Application Date: 2010-12-03
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Publication No.: US08376012B2Publication Date: 2013-02-19
- Inventor: Syozo Kadota
- Applicant: Syozo Kadota
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2009-277679 20091207
- International Application: PCT/JP2010/007050 WO 20101203
- International Announcement: WO2011/070753 WO 20110616
- Main IPC: B32B38/18
- IPC: B32B38/18

Abstract:
In a component press-bonding apparatus including a press-bonding tool for press-bonding a component, which is placed on a panel, to the panel via a sheet, the press-bonding tool is provided so as to be movable in a first direction (X-axis direction) orthogonal to a press-bonding direction. The component press-bonding apparatus has a sheet conveyance unit comprising: a feed reel which feeds a sheet in a second direction (Y-axis direction) orthogonal to the press-bonding direction and the first direction and which is movable in the first direction; a path member which forms a sheet path extending from the feed reel in the second direction and reaching the press-bonding tool and which is movable in the first direction; and a feed roller for feeding the sheet in the second direction. The feed roller is removably fitted to the sheet conveyance unit.
Public/Granted literature
- US20120241072A1 COMPONENT PRESS-BONDING APPARATUS AND COMPONENT PRESS-BONDING METHOD Public/Granted day:2012-09-27
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