Invention Grant
- Patent Title: Component mounting apparatus, mounting-component producing method, and conveyor apparatus
- Patent Title (中): 部件安装装置,安装部件制造方法以及输送装置
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Application No.: US13453558Application Date: 2012-04-23
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Publication No.: US08376129B2Publication Date: 2013-02-19
- Inventor: Akira Kimura , Katsuhiko Ohno , Atsushi Saito
- Applicant: Akira Kimura , Katsuhiko Ohno , Atsushi Saito
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rader, Fishman & Grauer PLLC
- Priority: JP2008-100113 20080408
- Main IPC: B65G21/20
- IPC: B65G21/20

Abstract:
A conveyor apparatus includes a conveyor portion, a side member having first and second side members, a connecting member, a first locking member and a driving unit. The first locking mechanism attached to the second side member locks and unlocks a connection between the second side member and the connecting member. In an unlocked state, the second member is movable along the connecting member towards or away from the first member. In a locked state, the second member is immovable relative to the first member. The driving unit is operative to move the second side member along the first direction close to or away from the first side member when the first locking mechanism is in the unlocked state and is operative to move the conveyor portion, the side member and the connecting member in unison along the first direction when the first locking mechanism is in the locked state.
Public/Granted literature
- US20120267216A1 COMPONENT MOUNTING APPARATUS, MOUNTING-COMPONENT PRODUCING METHOD, AND CONVEYOR APPARATUS Public/Granted day:2012-10-25
Information query
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