Systems and methods can produce thermal images of the mounting of a thermally-enhanced integrated circuit (IC) upon a circuit board. The system includes a thermal imaging camera that is operable to image the thermal dissipation and/or conduction through the heat sink into a mounting pad on the substrate. In testing the thermally-enhanced IC, the substrate or IC is connected to a power source, and the IC is operated such that the IC begins to generate heat. As the heat is conducted or dissipated through the heat sink into the mounting pad, a thermal imaging camera can detect the heat conduction and/or dissipation through the heat sink into the substrate. If there are voids or other types of failures in the mounting of the IC, the thermal imaging camera can detect cooler or colder spots in the image.