Invention Grant
- Patent Title: Contactless IC label
- Patent Title (中): 非接触式IC标签
-
Application No.: US13129268Application Date: 2009-11-13
-
Publication No.: US08376236B2Publication Date: 2013-02-19
- Inventor: Tatsurou Ozawa , Hidemi Nakajima , Kozue Furuichi , Hidehiko Kando , Shin Kataoka
- Applicant: Tatsurou Ozawa , Hidemi Nakajima , Kozue Furuichi , Hidehiko Kando , Shin Kataoka
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Toppan Printing Co., Ltd.,Hitachi, Ltd.
- Current Assignee: Toppan Printing Co., Ltd.,Hitachi, Ltd.
- Current Assignee Address: JP Tokyo JP Tokyo
- Priority: JPP2008-292522 20081114
- International Application: PCT/JP2009/006098 WO 20091113
- International Announcement: WO2010/055683 WO 20100520
- Main IPC: G06K19/02
- IPC: G06K19/02 ; G06K7/08 ; G06K19/06

Abstract:
A contactless integrated circuit (IC) label has an IC chip and is capable of exchanging data with an external reading device without contact. The contactless IC label includes: a transparent label base material; an optical variable device formed on a lower surface of the label base material; a conductive layer bonded to and formed on a lower surface of the optical variable device, and configured to function as an antenna of the IC chip; a connecting layer electrically connected to the IC chip; an insulating layer formed between the conductive layer and the connecting layer, and configured to electrically couple the conductive layer and the connecting layer; and an impedance adjusting unit formed on at least the connecting layer of the conductive layer and the connecting layer, and configured to adjust impedances of the conductive layer and the IC chip.
Public/Granted literature
- US20110290892A1 CONTACTLESS IC LABEL Public/Granted day:2011-12-01
Information query