Invention Grant
- Patent Title: Head attachment member and liquid ejection device
- Patent Title (中): 头部附件和液体喷射装置
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Application No.: US13009009Application Date: 2011-01-19
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Publication No.: US08376521B2Publication Date: 2013-02-19
- Inventor: Hiroyuki Ishii , Hiroyuki Hagiwara
- Applicant: Hiroyuki Ishii , Hiroyuki Hagiwara
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Global IP Counselors, LLP
- Priority: JP2010-020794 20100201
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16

Abstract:
A head attachment member, in which a plurality of liquid ejection heads is attached with respect to a support drum for supporting an ejection-receiving medium, includes a plurality of head attachment parts each having a first attachment surface to which head groups are attached with the head groups each including the liquid ejection heads, and a base part having second attachment surfaces to which the head attachment parts are attached. The second attachment surfaces each having a different tilt angle. Each of the first attachment surfaces is arranged to be parallel to a tangent line which is tangent to a peripheral surface of the support drum at an intersection point of a line segment which connects the center of the support drum and the center on the first attachment surfaces between the head groups attached to the first attachment surfaces. The second attachment surfaces are integrally and continuously formed.
Public/Granted literature
- US20110187795A1 HEAD ATTACHMENT MEMBER AND LIQUID EJECTION DEVICE Public/Granted day:2011-08-04
Information query
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