Invention Grant
- Patent Title: Slip ring device
- Patent Title (中): 滑环装置
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Application No.: US13288075Application Date: 2011-11-03
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Publication No.: US08376757B2Publication Date: 2013-02-19
- Inventor: Atsushi Yamamoto , Kaoru Endo
- Applicant: Atsushi Yamamoto , Kaoru Endo
- Applicant Address: JP Gumma
- Assignee: Nidec Servo Corporation
- Current Assignee: Nidec Servo Corporation
- Current Assignee Address: JP Gumma
- Agency: Keating & Bennett, LLP
- Priority: JP2010-247053 20101104
- Main IPC: H01R39/00
- IPC: H01R39/00

Abstract:
A slip ring device includes a hollow pipe-shaped shaft rotatably supported inside a tubular body of a main case through a bearing and an electricity-collecting body integrally and concentrically provided in the shaft. The electricity-collecting body preferably includes a plurality of electricity-collecting rings and a plurality of insulating rings alternately layered with one another. The slip ring device further includes a plurality of brushes held by the main case and tip end portions making sliding contact with outer circumferential surfaces of the electricity-collecting rings and a plurality of lead lines introduced into the shaft. The lead lines include tip end portions electrically connected to the respective electricity-collecting rings. Two or more of the lead lines include shielded lines.
Public/Granted literature
- US20120115335A1 SLIP RING DEVICE Public/Granted day:2012-05-10
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