Invention Grant
- Patent Title: Cylindrical grinder and cylindrical grinding method of ingot
- Patent Title (中): 圆柱磨床和锭的圆柱磨削方法
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Application No.: US12708842Application Date: 2010-02-19
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Publication No.: US08376809B2Publication Date: 2013-02-19
- Inventor: Ryoichi Kaito
- Applicant: Ryoichi Kaito
- Applicant Address: JP Tokyo
- Assignee: Sumco Corporation
- Current Assignee: Sumco Corporation
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein P.L.C.
- Priority: JP2009-042888 20090225
- Main IPC: B24B1/00
- IPC: B24B1/00

Abstract:
A cylindrical grinder is disclosed that includes a support unit including an upper support device and a lower support device, in which an ingot of silicon single crystal is interposed in a direction of axis line between the upper support device and the lower support device and is clampingly held to be rotated around the axis line, and a grinding unit that relatively moves along the direction of axis line of the ingot to traverse grind an outer circumference of the ingot. The upper support device is placed at an upper position and the lower support device is placed at a lower position, so that the support unit clampingly holds the ingot in a state in which the direction of the axis line of the ingot is disposed along a vertical direction.
Public/Granted literature
- US20100216375A1 CYLINDRICAL GRINDER AND CYLINDRICAL GRINDING METHOD OF INGOT Public/Granted day:2010-08-26
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