Invention Grant
- Patent Title: Method for manufacturing micro-channel, die for molding micro-channel chip, and micro-channel chip
- Patent Title (中): 微通道制造方法，微通道芯片成型模具和微通道芯片
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Application No.: US13059494Application Date: 2009-08-17
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Publication No.: US08377362B2Publication Date: 2013-02-19
- Inventor: Kanji Sekihara , Takehiko Goshima
- Applicant: Kanji Sekihara , Takehiko Goshima
- Applicant Address: JP Tokyo
- Assignee: Konica Minolta Opto, Inc.
- Current Assignee: Konica Minolta Opto, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Cozen O'Connor
- Priority: JP2008-211933 20080820
- International Application: PCT/JP2009/064388 WO 20090817
- International Announcement: WO2010/021306 WO 20100225
- Main IPC: B29C33/42
- IPC: B29C33/42 ; B29C45/16
Abstract:
A die (100) is provided with: a cavity which can contain a molten resin; a micro-structure (102) provided on a molding transfer surface (101) forming the cavity such that the fine structure protrudes to the cavity side from the molding transfer surface (101); and a anti-shrinkage convex section (103) protruding higher than the micro-structure (102) to the cavity side from one surface. A molten resin is applied to the die (100) and the surface of the die is relatively removed in the order of the micro-structure (102) and the anti-shrinkage convex section (103) from a resin substrate (001) formed by solidifying the resin.
Public/Granted literature
- US20110133364A1 Method for Manufacturing Micro-Channel, Die for Molding Micro-Channel Chip, and Micro-Channel Chip Public/Granted day:2011-06-09
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