Invention Grant
- Patent Title: Transfer film, method of manufacturing the same, transfer method and object surface structure
- Patent Title (中): 转印膜，制造方法，转印方法和物体表面结构
-
Application No.: US12581895Application Date: 2009-10-20
-
Publication No.: US08377540B2Publication Date: 2013-02-19
- Inventor: Ju-Chen Chiu , Yin Ta Chen
- Applicant: Ju-Chen Chiu , Yin Ta Chen
- Applicant Address: TW Taipei
- Assignee: Compal Electronics, Inc.
- Current Assignee: Compal Electronics, Inc.
- Current Assignee Address: TW Taipei
- Agency: Jianq Chyun IP Office
- Main IPC: B41B3/00
- IPC: B41B3/00
Abstract:
A transfer film including a protection layer and a substrate is provided. The substrate has a first surface with a first three-dimensional pattern and a second surface. The first three-dimensional pattern has at least one protrusion portion or at least one recess portion. The protection layer is disposed on the substrate and has a third surface and a fourth surface. The third surface contacts the first surface and has a second three-dimensional pattern complementary to the first three-dimensional pattern. The second three-dimensional pattern of the third surface is formed by covering the first three-dimensional pattern of the first surface. The protection layer and the substrate are separated after transfer, so as to expose the second three-dimensional pattern.
Public/Granted literature
- US20100104807A1 TRANSFER FILM, METHOD OF MANUFACTURING THE SAME, TRANSFER METHOD AND OBJECT SURFACE STRUCTURE Public/Granted day:2010-04-29
Information query
