Invention Grant
US08377545B2 Bonded article with nanoscopic dendrimers and method of preparing same
有权
具有纳米级树枝状聚合物的粘合制品及其制备方法
- Patent Title: Bonded article with nanoscopic dendrimers and method of preparing same
- Patent Title (中): 具有纳米级树枝状聚合物的粘合制品及其制备方法
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Application No.: US12562843Application Date: 2009-09-18
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Publication No.: US08377545B2Publication Date: 2013-02-19
- Inventor: Guiqin Song , T. Brian McAneney , Nan-Xing Hu , Gordon Sisler
- Applicant: Guiqin Song , T. Brian McAneney , Nan-Xing Hu , Gordon Sisler
- Applicant Address: US CT Norwalk
- Assignee: Xerox Corporation
- Current Assignee: Xerox Corporation
- Current Assignee Address: US CT Norwalk
- Agency: MH2 Technology Law Group LLP
- Main IPC: B32B3/00
- IPC: B32B3/00
Abstract:
Exemplary embodiments provide materials and methods for bonded articles using dendrimers for facilitating adhesion between an adhesive and a substrate with low surface free energy.
Public/Granted literature
- US20110070414A1 BONDED ARTICLE WITH NANOSCOPIC DENDRIMERS AND METHOD OF PREPARING SAME Public/Granted day:2011-03-24
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