Invention Grant
- Patent Title: Multilayer structures with common tie layer
- Patent Title (中): 多层结构与普通粘结层
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Application No.: US12655434Application Date: 2009-12-30
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Publication No.: US08377562B2Publication Date: 2013-02-19
- Inventor: Maged G. Botros
- Applicant: Maged G. Botros
- Applicant Address: US TX Houston
- Assignee: Equistar Chemicals, LP
- Current Assignee: Equistar Chemicals, LP
- Current Assignee Address: US TX Houston
- Main IPC: B32B27/00
- IPC: B32B27/00
Abstract:
Multilayer structures having layers of a styrene polymer, polyethylene, propylene polymer, and common tie layers of a styrene-butadiene-styrene triblock copolymer-containing adhesive.
Public/Granted literature
- US20110159297A1 Multilayer structures with common tie layer Public/Granted day:2011-06-30
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