Invention Grant
- Patent Title: Method of reducing microloading effect
- Patent Title (中): 降低微载荷效应的方法
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Application No.: US13118447Application Date: 2011-05-29
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Publication No.: US08377632B2Publication Date: 2013-02-19
- Inventor: Hsiu-Chun Lee , Yi-Nan Chen , Hsien-Wen Liu
- Applicant: Hsiu-Chun Lee , Yi-Nan Chen , Hsien-Wen Liu
- Applicant Address: TW Kueishan, Tao-Yuan Hsien
- Assignee: Nanya Technology Corp.
- Current Assignee: Nanya Technology Corp.
- Current Assignee Address: TW Kueishan, Tao-Yuan Hsien
- Agent Winston Hsu; Scott Margo
- Main IPC: G03F7/26
- IPC: G03F7/26

Abstract:
The present invention provides a method of reducing microloading effect by using a photoresist layer as a buffer. The method includes: providing a substrate defined with a dense region and an isolated region. Then, a dense feature pattern and an isolated feature pattern are formed on the dense region and the isolated region respectively. After that, a photoresist layer is formed to cover the isolated region. Finally, the substrate and the photoresist layer are etched by taking the dense feature pattern and the isolated feature pattern as a mask.
Public/Granted literature
- US20120301833A1 METHOD OF REDUCING MICROLOADING EFFECT Public/Granted day:2012-11-29
Information query
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