Invention Grant
US08377798B2 Method and structure for wafer to wafer bonding in semiconductor packaging
有权
半导体封装中晶圆与晶圆接合的方法和结构
- Patent Title: Method and structure for wafer to wafer bonding in semiconductor packaging
- Patent Title (中): 半导体封装中晶圆与晶圆接合的方法和结构
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Application No.: US12943281Application Date: 2010-11-10
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Publication No.: US08377798B2Publication Date: 2013-02-19
- Inventor: Jung-Huei Peng , Hsin-Ting Huang , Yao-Te Huang , Shang-Ying Tsai , Ping-Yin Liu
- Applicant: Jung-Huei Peng , Hsin-Ting Huang , Yao-Te Huang , Shang-Ying Tsai , Ping-Yin Liu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L21/46 ; H01L21/311
Abstract:
A method for wafer to wafer bonding in semiconductor packaging provides for roughening the bonding surfaces in one embodiment. Also provided is a method for passivating the bonding surfaces with a lower melting point material that becomes forced away from the bonding interface during bonding. Also provided is a method for forming an eutectic at the bonding interface to reduce the impact of any native oxide formation at the bonding interface.
Public/Granted literature
- US20120115305A1 METHOD AND STRUCTURE FOR WAFER TO WAFER BONDING IN SEMICONDUCTOR PACKAGING Public/Granted day:2012-05-10
Information query
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