Invention Grant
- Patent Title: Wired circuit board
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Application No.: US12285600Application Date: 2008-10-09
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Publication No.: US08378226B2Publication Date: 2013-02-19
- Inventor: Makoto Tsunekawa , Kei Nakamura , Takatoshi Sakakura , Yoshihiro Toyoda
- Applicant: Makoto Tsunekawa , Kei Nakamura , Takatoshi Sakakura , Yoshihiro Toyoda
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2007-288262 20071106
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H01L23/58
Abstract:
A wired circuit board includes a conductive pattern, and an insulating layer covering the conductive pattern and having a transmittance of not more than 30% with respect to a wavelength in a range of 600 to 680 nm.
Public/Granted literature
- US20090114426A1 Wired circuit board Public/Granted day:2009-05-07
Information query
