Invention Grant
- Patent Title: Multi-piece board and fabrication method therefor
- Patent Title (中): 多片板及其制造方法
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Application No.: US12537713Application Date: 2009-08-07
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Publication No.: US08378237B2Publication Date: 2013-02-19
- Inventor: Yasushi Hasegawa
- Applicant: Yasushi Hasegawa
- Applicant Address: JP Ogaki-shi
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-288261 20081110
- Main IPC: H01R13/502
- IPC: H01R13/502 ; H01R43/20

Abstract:
A method for fabricating a multi-piece board includes: preparing a board main portion having a first coupling member and multiple piece portions connected to the first coupling member, the first coupling member forming a part of a coupling member of a multi-piece board, each of the piece portions having a printed wiring board; preparing a second coupling member which forms the coupling member together with the first coupling member; and adhering the second coupling member to the first coupling member of the board main portion, thereby yielding the multi-piece board.
Public/Granted literature
- US20100118504A1 MULTI-PIECE BOARD AND FABRICATION METHOD THEREFOR Public/Granted day:2010-05-13
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