Invention Grant
- Patent Title: Laser processing apparatus
- Patent Title (中): 激光加工设备
-
Application No.: US12610718Application Date: 2009-11-02
-
Publication No.: US08378257B2Publication Date: 2013-02-19
- Inventor: Keiji Nomaru , Taiki Sawabe
- Applicant: Keiji Nomaru , Taiki Sawabe
- Applicant Address: JP Tokyo
- Assignee: Disco Corporation
- Current Assignee: Disco Corporation
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain, Ltd.
- Priority: JP2008-306844 20081201
- Main IPC: B23K26/14
- IPC: B23K26/14

Abstract:
A laser processing apparatus including a detecting unit. The detecting unit includes a white light source for emitting white light, a focusing lens for focusing the white light to the workpiece, a first optical fiber for guiding the white light emitted from the white light source to the focusing lens, a detector for detecting the intensity of reflected light from the workpiece, and a second optical fiber for guiding the reflected light to the detector. Accordingly, the white light to be focused to the workpiece can be easily handled and only a wavelength component focused on the workpiece can be stably propagated.
Public/Granted literature
- US20100133243A1 LASER PROCESSING APPARATUS Public/Granted day:2010-06-03
Information query
IPC分类: