Invention Grant
- Patent Title: LED package
- Patent Title (中): LED封装
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Application No.: US13289587Application Date: 2011-11-04
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Publication No.: US08378347B2Publication Date: 2013-02-19
- Inventor: Satoshi Shimizu , Kazuhisa Iwashita , Teruo Takeguchi , Tetsuro Komatsu , Hiroaki Oshio , Tatsuo Tonedachi , Naoya Ushiyama , Kazuhiro Inoue , Gen Watari
- Applicant: Satoshi Shimizu , Kazuhisa Iwashita , Teruo Takeguchi , Tetsuro Komatsu , Hiroaki Oshio , Tatsuo Tonedachi , Naoya Ushiyama , Kazuhiro Inoue , Gen Watari
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Turocy & Watson, LLP
- Priority: JP2010-019768 20100129
- Main IPC: H01L25/075
- IPC: H01L25/075 ; H01L33/62 ; H01L21/329 ; H01L21/56 ; H01L21/58 ; H01L21/60 ; H01L33/50
Abstract:
According to one embodiment, an LED package includes first and second lead frames spaced from each other, and an LED chip. Each of the first and second lead frames includes a base portion and a plurality of extending portions extending from the base portion. A part of a lower surface of the base portion, side surfaces of the base portion, lower surfaces of the extending portions and side surfaces of the extending portions are covered by resin. A remaining part of the lower surface of the base portion and tip surfaces of the extending portions are not covered by resin. The part of the lower surface of the base portion includes a first edge of the first lead frame and a second edge of the second lead frame. The first edge and the second edge are opposed each other.
Public/Granted literature
- US20120080674A1 LED PACKAGE Public/Granted day:2012-04-05
Information query
IPC分类:
