Invention Grant
- Patent Title: Light emitting package
- Patent Title (中): 发光包装
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Application No.: US13399709Application Date: 2012-02-17
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Publication No.: US08378360B2Publication Date: 2013-02-19
- Inventor: Jun Seok Park
- Applicant: Jun Seok Park
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2004-0107782 20041217
- Main IPC: H01L29/267
- IPC: H01L29/267

Abstract:
The present invention discloses a light emitting package, comprising: a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; a gold layer on the electrical circuit layer; a wire electrically connected between the light emitting device and the gold layer; a screen member having an opening and disposed on the base adjacent to the light emitting device; and a lens covering the light emitting device, wherein a bottom surface of the screen member is positioned higher than the light emitting device, and wherein an entire uppermost surface of the screen member is in contact with the lens.
Public/Granted literature
- US20120146082A1 LIGHT EMITTING PACKAGE Public/Granted day:2012-06-14
Information query
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