Invention Grant
- Patent Title: Trench MOSFET with body region having concave-arc shape
- Patent Title (中): 沟槽MOSFET,其体区具有凹弧形状
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Application No.: US12662241Application Date: 2010-04-07
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Publication No.: US08378392B2Publication Date: 2013-02-19
- Inventor: Fu-Yuan Hsieh
- Applicant: Fu-Yuan Hsieh
- Applicant Address: TW
- Assignee: Force Mos Technology Co., Ltd.
- Current Assignee: Force Mos Technology Co., Ltd.
- Current Assignee Address: TW
- Agency: Bacon & Thomas, PLLC
- Main IPC: H01L27/088
- IPC: H01L27/088

Abstract:
A trench Metal Oxide Semiconductor Field Effect Transistor with improved body region structures is disclosed. By forming the inventive body region structures with concave-arc shape with respect to epitaxial layer, a wider interfaced area between the body region and the epitaxial layer is achieved, thus increasing capacitance between drain and source Cds. Moreover, the invention further comprises a Cds enhancement doped region interfaced with said body region having higher doping concentration than the epitaxial layer to further enhancing Cds without significantly impact breakdown voltage.
Public/Granted literature
- US20110248340A1 Trench mosfet with body region having concave-arc shape Public/Granted day:2011-10-13
Information query
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