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US08378442B2 Epoxy resin composition for optical semiconductor light-receiving element encapsulation and process for producing the same, and optical semiconductor device 有权
光半导体光接收元件封装用环氧树脂组合物及其制造方法以及光半导体装置

  • Patent Title: Epoxy resin composition for optical semiconductor light-receiving element encapsulation and process for producing the same, and optical semiconductor device
  • Patent Title (中): 光半导体光接收元件封装用环氧树脂组合物及其制造方法以及光半导体装置
  • Application No.: US12719077
    Application Date: 2010-03-08
  • Publication No.: US08378442B2
    Publication Date: 2013-02-19
  • Inventor: Kazuhiro Fuke
  • Applicant: Kazuhiro Fuke
  • Applicant Address: JP Osaka
  • Assignee: Nitto Denko Corporation
  • Current Assignee: Nitto Denko Corporation
  • Current Assignee Address: JP Osaka
  • Agency: Sughrue Mion, PLLC
  • Priority: JP2009-055391 20090309
  • Main IPC: H01L31/0203
  • IPC: H01L31/0203 ;  C08L63/00
Epoxy resin composition for optical semiconductor light-receiving element encapsulation and process for producing the same, and optical semiconductor device
Abstract:
The present invention relates to an epoxy resin composition for optical semiconductor light-receiving element encapsulation, the epoxy resin composition including the following components (A) to (D): (A) an epoxy resin; (B) a curing agent; (C) a curing accelerator; and (D) a yellow colorant, in which the component (D) is contained in a ratio of 0.01% by weight or more based on the whole of the epoxy resin composition.
Abstract(Chinese):

本发明涉及用于光学半导体光接收元件封装的环氧树脂组合物，该环氧树脂组合物包含以下组分（A）至（D）：（A）环氧树脂; （B）固化剂; （C）固化促进剂; 和（D）基于整个环氧树脂组合物，其中组分（D）的含量为0.01重量％以上的黄色着色剂。

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