Described herein are wafer-level semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a semiconductor device; (2) a package body covering lateral surfaces of the semiconductor device, a lower surface of the package body and a lower surface of the semiconductor device defining a front surface; (3) a set of redistribution layers disposed adjacent to the front surface, the set of redistribution layers including a grounding element that includes a connection surface electrically exposed adjacent to at least one lateral surface of the set of redistribution layers; and (4) an EMI shield disposed adjacent to the package body and electrically connected to the connection surface of the grounding element. The grounding element provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.