Invention Grant
- Patent Title: Dummy wafers in 3DIC package assemblies
- Patent Title (中): 3DIC封装组件中的虚拟晶圆
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Application No.: US12717779Application Date: 2010-03-04
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Publication No.: US08378480B2Publication Date: 2013-02-19
- Inventor: Ming-Fa Chen , Chia-Yen Lee
- Applicant: Ming-Fa Chen , Chia-Yen Lee
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L21/00
Abstract:
A package structure includes a first die, and a second die over and bonded to the first die. The second die has a size smaller than a size of the first die. A dummy chip is over and bonded onto the first die. The dummy chip includes a portion encircling the second die. The dummy chip includes a material selected from the group consisting essentially of silicon and a metal.
Public/Granted literature
- US20110215470A1 Dummy Wafers in 3DIC Package Assemblies Public/Granted day:2011-09-08
Information query
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