Invention Grant
- Patent Title: Semiconductor module with micro-buffers
- Patent Title (中): 具有微缓冲器的半导体模块
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Application No.: US13420341Application Date: 2012-03-14
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Publication No.: US08378481B2Publication Date: 2013-02-19
- Inventor: Frank Lambrecht
- Applicant: Frank Lambrecht
- Applicant Address: US CA Sunnyvale
- Assignee: Rambus Inc.
- Current Assignee: Rambus Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L21/00
Abstract:
The semiconductor module includes a plurality of memory die on a first side of a substrate and a plurality of buffer die on a second side of the substrate. Each of the memory die is disposed opposite and electrically coupled to one of the buffer die.
Public/Granted literature
- US20120181704A1 SEMICONDUCTOR MODULE WITH MICRO-BUFFERS Public/Granted day:2012-07-19
Information query
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