Invention Grant
US08378484B2 Semiconductor device, method for manufacturing semiconductor device, and electronic appliance having the semiconductor device
有权
半导体装置，半导体装置的制造方法以及具有该半导体装置的电子设备
- Patent Title: Semiconductor device, method for manufacturing semiconductor device, and electronic appliance having the semiconductor device
- Patent Title (中): 半导体装置，半导体装置的制造方法以及具有该半导体装置的电子设备
-
Application No.: US11790481Application Date: 2007-04-25
-
Publication No.: US08378484B2Publication Date: 2013-02-19
- Inventor: Daiki Yamada , Tomoyuki Aoki
- Applicant: Daiki Yamada , Tomoyuki Aoki
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2006-123589 20060427
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
In order to connect a semiconductor device including an integrated circuit to an external circuit typified by an antenna, the shape of the contact electrode to be formed in the semiconductor device is devised, so that bad connection between the external circuit and the contact electrode is not easily caused and the contact electrode with high reliability is provided. The contact electrode is formed by a screen printing method using a squeegee having a chamfered corner or having a wedge shape. The contact electrode has a peripheral portion and a central portion. The peripheral portion has a tapered portion with its film thickness gradually decreasing from the central portion toward the end portion, and the central portion has a projection portion that continues from the tapered portion.
Public/Granted literature
Information query
IPC分类:
