Invention Grant
- Patent Title: Solder interconnect by addition of copper
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Application No.: US12501686Application Date: 2009-07-13
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Publication No.: US08378485B2Publication Date: 2013-02-19
- Inventor: Mark A. Bachman , John W. Osenbach , Kishor V. Desai
- Applicant: Mark A. Bachman , John W. Osenbach , Kishor V. Desai
- Applicant Address: US CA Milpitas
- Assignee: LSI Corporation
- Current Assignee: LSI Corporation
- Current Assignee Address: US CA Milpitas
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A method of forming an electronic device provides an electronic device substrate having a solder bump pad located thereover. A nickel-containing layer is located over the solder bump pad. A copper-containing layer is formed on the nickel-containing layer prior to subjecting the electronic device to a reflow process.
Public/Granted literature
- US20110006415A1 SOLDER INTERCONNECT BY ADDITION OF COPPER Public/Granted day:2011-01-13
Information query
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