Invention Grant
US08378503B2 Apparatus for thermal control of semiconductor chip assembly and underfill
有权
用于半导体芯片组装和底部填充的热控制的装置
- Patent Title: Apparatus for thermal control of semiconductor chip assembly and underfill
- Patent Title (中): 用于半导体芯片组装和底部填充的热控制的装置
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Application No.: US13341011Application Date: 2011-12-30
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Publication No.: US08378503B2Publication Date: 2013-02-19
- Inventor: Vikas Gupta , Jeremias Perez Libres , Joseph Edward Grigalunas
- Applicant: Vikas Gupta , Jeremias Perez Libres , Joseph Edward Grigalunas
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Steven A. Shaw; W. James Brady; Frederick J. Telecky, Jr.
- Main IPC: H01L23/28
- IPC: H01L23/28
Abstract:
Apparatus for assembling a semiconductor device has a plate with body and a surface heatable to a controlled a temperature profile from location to location across the plate. Mesas at same temperature of plate protrude from the surface are configured to support a portion of the substrate. Movable capillaries have openings for blowing cooled gas onto selected locations of the assembly. At least one movable syringe movable has an opening for dispensing a polymer precursor.
Public/Granted literature
- US20120097095A1 Thermal Method to Control Underfill Flow in Semiconductor Devices Public/Granted day:2012-04-26
Information query
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