Invention Grant
US08378507B2 Semiconductor device and method of bonding wires between semiconductor chip and wiring substrate
失效
在半导体芯片和布线基板之间接合引线的半导体器件和方法
- Patent Title: Semiconductor device and method of bonding wires between semiconductor chip and wiring substrate
- Patent Title (中): 在半导体芯片和布线基板之间接合引线的半导体器件和方法
-
Application No.: US12572326Application Date: 2009-10-02
-
Publication No.: US08378507B2Publication Date: 2013-02-19
- Inventor: Satoshi Itaya , Dai Sasaki , Mitsuaki Katagirl
- Applicant: Satoshi Itaya , Dai Sasaki , Mitsuaki Katagirl
- Applicant Address: JP Tokyo
- Assignee: Elpida Memory, Inc.
- Current Assignee: Elpida Memory, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Young & Thompson
- Priority: JP2008-257367 20081002
- Main IPC: H01L23/49
- IPC: H01L23/49
Abstract:
A wiring substrate and a semiconductor chip mounted on the wiring substrate are connected together via a bonding wire. The distance from each end of the semiconductor chip to a wire bond pad provided on the wiring substrate is smaller than the height of the semiconductor chip.
Public/Granted literature
- US20100084773A1 SEMICONDUCTOR DEVICE AND METHOD OF BONDING WIRES BETWEEN SEMICONDUCTOR CHIP AND WIRING SUBSTRATE Public/Granted day:2010-04-08
Information query
IPC分类:
