Invention Grant
- Patent Title: Self-testing sensor apparatus and method
- Patent Title (中): 自检传感器装置及方法
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Application No.: US12046833Application Date: 2008-03-12
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Publication No.: US08378672B2Publication Date: 2013-02-19
- Inventor: Reiner Bidenbach , Klaus Heberle
- Applicant: Reiner Bidenbach , Klaus Heberle
- Applicant Address: DE Freiburg I. Br.
- Assignee: Micronas GmbH
- Current Assignee: Micronas GmbH
- Current Assignee Address: DE Freiburg I. Br.
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Priority: DE102007012214 20070312
- Main IPC: G01R33/07
- IPC: G01R33/07

Abstract:
A semiconductor component on a semiconductor chip comprises at least one sensor element for measuring a physical quantity and an evaluator. The semiconductor component can be switched between a first and a second operating mode. In the first operating mode, the sensor element is sensitive to the physical quantity to be measured and a measurement signal output of the sensor element is connected to an input connection of the evaluator. In the second operating mode, the sensor element is not sensitive to the physical quantity to be measured and/or the signal path between the measurement signal output and the input connection is interrupted. A test signal source for generating a test signal simulating the measurement signal of the sensor element is arranged on the semiconductor chip. In the second operating mode, the test signal source is connected or capable of being connected to the input connection of the evaluator.
Public/Granted literature
- US20080224694A1 Semiconductor component and method for testing such a component Public/Granted day:2008-09-18
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