Invention Grant
- Patent Title: Layered bandpass filter
- Patent Title (中): 分层带通滤波器
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Application No.: US12890120Application Date: 2010-09-24
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Publication No.: US08378763B2Publication Date: 2013-02-19
- Inventor: Eiko Wakata
- Applicant: Eiko Wakata
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2009-223676 20090929
- Main IPC: H01P1/203
- IPC: H01P1/203 ; H03H7/32

Abstract:
A bandpass filter includes three resonators of which adjacent two are electromagnetically coupled to each other, and two coupling paths connected in parallel for forming capacitive coupling between non-adjacent two of the resonators. Each of the two coupling paths includes at least one capacitor and an inductor connected in series. The two coupling paths function to form an attenuation pole at a frequency lower than the passband frequencies in the pass attenuation characteristics of the bandpass filter.
Public/Granted literature
- US20110074527A1 LAYERED BANDPASS FILTER Public/Granted day:2011-03-31
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