Invention Grant
- Patent Title: Method of forming metal to a concave portion of a substrate, method of manufacturing a magnetic head and a magnetic head
- Patent Title (中): 将金属形成到基板的凹部的方法，制造磁头和磁头的方法
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Application No.: US13194789Application Date: 2011-07-29
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Publication No.: US08379346B1Publication Date: 2013-02-19
- Inventor: Hisayoshi Watanabe , Yuji Matsuura , Takayuki Nishizawa , Masashi Sano , Tetsuji Hori
- Applicant: Hisayoshi Watanabe , Yuji Matsuura , Takayuki Nishizawa , Masashi Sano , Tetsuji Hori
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Posz Law Group, PLC
- Main IPC: G11B5/31
- IPC: G11B5/31
Abstract:
The present invention relates to a method of forming a metal in a concave portion of a substrate. The method includes a step of preparing a substrate having a concave portion; a step of applying a liquid coating member on the substrate and filling in and solidifying the concave portion with the coating member; a step of covering the coating member with a resist; a step of forming a penetrating hole that penetrates the resist in a position of the concave portion of the substrate; a step of removing the coating member within the concave portion; and a step of filling a metal into a portion where the coating member has been removed.
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