A bus interconnect in accordance with present embodiments includes a via block having first and second interfaces separated by a conductive body, wherein the via block is configured to communicatively couple with a first bus through the first interface and wherein the conductive body is configured to extend through an opening in a bus support panel. A first coupling section of the jumper includes a first attachment feature, wherein the first attachment feature is configured to facilitate attachment with the second interface of the via block. A neck section of the jumper extends perpendicularly from the first coupling section, and a second coupling section of the jumper extends perpendicularly from the neck section in parallel with the first coupling section. The second coupling section includes a second attachment feature configured to facilitate attachment with a second bus. The first coupling section and the second coupling section each extend away from the neck section in different directions.