Invention Grant
- Patent Title: Spacer-connector and circuit board assembly
- Patent Title (中): 间隔连接器和电路板组件
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Application No.: US12750458Application Date: 2010-03-30
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Publication No.: US08379403B2Publication Date: 2013-02-19
- Inventor: David W. Waite , James L. Blair , Ashish Lohiya , Arvid G. Sammuli , Jeffrey T. Smith , Saritha Narra
- Applicant: David W. Waite , James L. Blair , Ashish Lohiya , Arvid G. Sammuli , Jeffrey T. Smith , Saritha Narra
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM, Incorporated
- Current Assignee: QUALCOMM, Incorporated
- Current Assignee Address: US CA San Diego
- Agent William M. Hooks
- Main IPC: H05K7/00
- IPC: H05K7/00
Abstract:
A spacer-connector and connection arrangements between daughter boards and motherboards are disclosed. Assemblies may include a daughter board one or more spacer-connectors spacing the daughter board above a motherboard and conductive elastomers providing electrical connections between the daughter board and spacer-connector and between the spacer-connector and the motherboard. The spacer-connector may include ground, power, digital and/or controlled impedance RF pathways to conduct signals between the daughter board to the mother board.
Public/Granted literature
- US20100255690A1 SPACER-CONNECTOR AND CIRCUIT BOARD ASSEMBLY Public/Granted day:2010-10-07
Information query
